5STP 12F4200
TC = 70° C. IC,nom. 75. A. DC-collector current. TC = 25 °C. IC. 95. A. Periodischer Kollektor Spitzenstrom repetitive peak collector current. tP = 1 ms, TC = ...
BSM 75 GD 60 DLC - Mouser ElectronicsDevant la commission d'examen formée de : M. P. BARTHELEMY. Professeur, Université de Bordeaux. Président. Développement de nouvelles molécules plateformes pourOn-state. ITAVM. Max. average on-state current. 1660 A. Half sine wave, TC = 70°C. ITRMS. Max. RMS on-state current. 2610 A. ITSM. Max. peak non-repetitive. 5STP 18F1800TC70 lei/kg. 1.75. TD-8816 lei/pc. 1. TD-8817 lei/pc. 1. TD-8840T lei/pc. 1. TD-VG5612 lei/pc. 1. TD-W8151N lei/pc. 1. TD-W8901N lei/pc. 1. TD-W8951ND lei/ ... Archer A64 Archer AX50 Archer AX53 Archer AX55 Archer AX72 ...Symbol. Test Conditions. Characteristic Values. Min. Typ. Max. SOA. VDS = - 200V, ID = - 0.8A, TC = 70°C, Tp = 5s 160. LVH150G1202 LVH150G1202Z*(1) Preliminary data SUSPM2@Tj = 150 °C, TC = 70 °C, Continuous. 150. A. ICM. @TC = 70 °C, tP = 1ms. 300. A. TSC. Chip Level, @Tj = 150 °C, VGE = 15 V, VCES < 1200 V. 10. µs. Tj. DDB6U30N08VRtp = 10 ms, Tvj = 25°C tp = 10 ms, Tvj = 150°C. IFsM. 310. 250. A. A ... td on. 0,018. 0,018. µs. µs. Tvj = 25°C. Tvj = 125°C. Anstiegszeit (induktive Last) rise ... 10-PG06PPA050SJ01-LH54E08T - VincotechBase isolation: Al2O3. ? Convex shaped substrate for superior thermal contact. ? Thermo-mechanical push-and-pull force relief. P-CHANNEL MOSFET - Micro Commercial ComponentsTC = 70 °C, Tvj = 150 °C. 1600. A. Peak collector current. ICM tp = 1 ms. 3200. A. Gate-emitter voltage. VGES. -20. 20. V. Total power dissipation. Ptot. TC = ... Datasheet 10-FZ06PPA030SJ-LS54E08 - VincotechPIM with integrated PFC. ? High switching frequency PFC circuit. ? On-board capacitor. ? New generation high speed IGBTs in the inverter. SiR608DP N-Channel 45 V (D-S) MOSFET - VishayPossibilité d'organiser des enseignements classiques (cours, TD, TP) mais également des enseignements tutorés et à distance (autoformation ... BSZ120P03NS3 G - Infineon TechnologiesDevice on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm² (one layer, 70 ?m thick) copper area for drain connection. The nature of global green finance standards-evolution, differences ...?EMA' serves business managers in making capital investment decisions, costing determinations, process/product design decisions, performance evaluation and a ...
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